# Network Acceleration
Complementing TCP with Homa, Stanford’s Reliable, Rapid Request-Response Protocol
Presentation at SNIA Storage Developers Conference, Santa Clara, CA, Sept. 16-18, 2024 At SDC 2023 last year, we presented Homa, a new datacenter protocol invented by John Ousterhout at Stanford…
MLE Releases NPAP TCP/UDP/IP Stack Version 2.4.1
MLE has released Version 2.4.1 of its Network Protocol Accelerator Platform (NPAP). NPAP is the TCP/UDP/IP Full Accelerator from Fraunhofer HHI which enjoys production use in FPGA applications for automotive,…
SNIA Storage Developers Conference, Sept. 16-18, 2024 in Santa Clara, CA
The Storage Developers Conference (SDC) 2024 of SNIA, the Storage and Networking Industry Alliance, will be held Sept. 16-18 in Santa Clara, CA. There, MLE will present “Complementing TCP with…
100/200/400G NVMe FPGA RAID
100/200/400G NVMe FPGA RAID Accelerate NVMe RAID Data Recording and Replay Some High-Speed Data Acquisition Systems do require storing the data in non-volatile memory. For those cases where the read/write…
Architecture and Performance of Integrated High-speed and Versatile Embedded Networking
Presentation at the Embedded World 2024, Nuremberg, Germany, Apr. 11, 2024 These days high-performance embedded systems operate highly interconnected. Within these networks the systems often transport data at high bandwidth…
TCP/IP for Real-Time Embedded Systems: The Good, the Bad and the Ugly
Presentation at the Embedded World 2024, Nuremberg, Germany, Apr. 9, 2024 Embedded systems such as in-vehicle networks, modern factory automation or autonomous robots, for example, are undergoing a major shift:…
MLE Updates TCP/UDP/IP Network Protocol Accelerator Platform
MLE has released an update, Version 2.3.3., of its Network Protocol Acceleration Platform (NPAP). This update is fixing minor issues with AXI4 bus scheduler fairness, IP Core packaging for AMD/Xilinx…
Shift-Left Your FPGA Design Project with FPGA Full System Stacks from Trenz Electronic and MLE
Visit us at Embedded World 2024! The Embedded World 2024 tradeshow will be held April 9-11 in Nuremberg, Germany. Here, partners Trenz Electronic and MLE will present solutions for you…
MLE Presents “Architecture and Performance of Integrated High-speed and Versatile Embedded Networking” at Embedded World 2024
The Embedded World Conference 2024 will be held April 9-11 in Nuremberg, Germany. There, MLE will present “Architecture and Performance of Integrated High-speed and Versatile Embedded Networking.” These days high-performance…