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MLE Participates at AMD/Xilinx Security Working Group

Details: Created: 06 December 2022

The AMD-Xilinx Security Working Group takes place face-to-face in Munich, Germany, from December 6-7, 2022. Presentations include the latest security features in Versal ACAP and updates for the product roadmap. MLE, a Premier AMD-Xilinx Alliance Member, will participate and present its security solutions for ARM OP-TEE and for hardening AMD-Xilinx Zynq UltraScale+ MPSoC based systems when used in datacenter networking and telecommunications.

MLE Joins Central Car Server Supercomputing Research for Automotive, Funded by German BMBF

Details: Created: 01 December 2022

Advanced Driver-Assist Systems (ADAS) and Autonomous Vehicle (AV) functions require a challeging combination of of compute performance and energy efficiency, especially when deployed in Battery Electric Vehicles (BEV). MLE has joined research initiative "Central Car Server (CeCaS)" to advance MLE's PCIe connectivity solutions based on PCIe NTB (Non-Transparent Bridging), PCIe ISB (Inter Systems Bridge), PCIe Long-Range Tunnel along with partners Infineon Technologies Dresden GmbH & Co. KG, Dresden, Robert Bosch GmbH, Continental Automotive Technologies GmbH, ZF Friedrichshafen AG, AVL Software and Functions GmbH, Hella GmbH & Co. KGaA, Infineon Technologies Semiconductor GmbH, Swissbit Germany AG, Kernkonzept GmbH, Ambrosys GmbH, STTech GmbH, Berliner Nanotest und Design GmbH, Glück Engineering GmbH, INCHRON AG, emmtrix Technologies GmbH, Karlsruher Institut für Technologie (KIT), FZI Forschungszentrum Informatik in Karlsruhe, Lübeck University, TU München, Hochschule für angewandte Wissenschaften München, TU Chemnitz, Steinbeis-Transferzentrum Wärmemanagement in der Elektronik (ZFW), Fraunhofer ENAS, Fraunhofer IPMS, Fraunhofer IMWS, Fraunhofer IZM. The "CeCaS" research project will investigate heterogeneous architectures and supercomputing for automotive and autonomous vehicles and is funded with 88.2 Mio Euros by the Research Initiative MANNHEIM from German Federal Ministry of Education and Research (BMBF).

Intel Partner Alliance Gold Status Renewed

Details: Created: 01 December 2022

Intel Corporation has renewed MLE's Gold Status membership in the Intel Partner Alliance for 2023. The Intel Partner Alliance unifies all partners in a modern program that enables collaboration and innovation. MLE ships Function Accelerator Cards based on Intel Stratix Series FPGAs and has been providing FPGA Design Services for a wide range of Intel FPGAs including Intel Agilex FPGAs and SoC FPGAs, Intel Stratix Series, Intel Arria Series, Intel MAX Series, Intel Cyclone Series and Intel eASIC. As a Gold Member of the Intel Partner Alliance MLE has access to FPGA Design Tools such as the Intel Quartus Prime Design Software, the Questa-Intel FPGA Edition Software plus the Open-Source Intel Compiler for SystemC.

MLE's Auto/TSN for Digital RADAR Networks Receives BMBF Funding

Details: Created: 01 December 2022

In-Vehicle Networks of the future will be driven by the large bandwidth needs of modern sensors, in particular Radar (Radio Detection and Ranging), and more importantly networks of digital Radar sensors. MLE has joined research initiative "VERANO" to advance MLE's Auto/TSN and to support research partners Infineon Technologies AG, Mercedes-Benz AG, Robert BOSCH GmbH, KPIT Technologies GmbH, Fraunhofer IPMS, KIT, Ulm University, Ruhr-University Bochum, Technical University Braunschweig and Kassel University with deep FPGA expertise. The "VERANO" project will investigate digital and energy-efficient Radar networks for automotive and autonomous vehicles and is funded with 11.1 Mio Euros by the Research Initiative OCTOPUS from German Federal Ministry of Education and Research (BMBF).

MLE exhibits at SC22

Details: Created: 04 November 2022

Partner ProDesign and MLE will showcase High-Performance Compute solutions at Super Computing Conference SC22. To address the acceleration needs of Disaggregated Computational Storage, ElasticSearch, or At-Speed In-Network Processing the featured solutions integrate MLE's FPGA-based networking and storage accelerators with ProDesign's FALCON 1SM21 HPC Card (based on Intel Stratix 10 MX/NX FPGA) and ProDesign's HAWK VC1902 HPC Card (based on AMD/Xilinx Versal FPGA). Also featured will be Homa, a reliable, rapid request-response protocol (RRRRP) from Stanford University professor John Ousterhout. SC22 is held November 13-18 in the Kay Bailey Hutchinson Convention Center Dallas, TX.

MLE Joins German 6G Radio Initiative, Receives BMBF Funding

Details: Created: 01 November 2022

Integrated Communication and Sensing (ICAS) has become a key research topic for realizing next-generation mobility solutions. For 6G Radio, ICAS enables sensor systems to cooperate and to interact via 6G Radio Sidelink. MLE has joined research project "6G-ICAS4Mobility" to closely collaborate with other research partners Robert BOSCH GmbH, AeroDCS GmbH, Barkhausen Institut gGmbH, CiS GmbH, Denso Automotive Deutschland GmbH, Friedrich-Alexander-University Erlangen-Nuremberg, Fraunhofer HHI, Hensoldt Sensors GmbH, IMST GmbH, Merantix Labs GmbH, NXP Semiconductors Germany GmbH, Technical University Ilmenau, Technical University Kaiserslautern and Ulm University. for realizing such systems. "6G-ICAS4Mobility" has been funded with 14.23 Mio Euros by the German Federal Ministry of Education and Research (BMBF) .

MLE Presents at SNIA SDC 2022

Details: Created: 21 July 2022

At SNIA Storage Developers Conference (SDC) 2022, on Sept. 14, MLE and partner Fraunhofer IPMS will present "Converging PCIe and TSN Ethernet for Composable Infrastructure in High-Performance In-Vehicle Embedded Systems": While the needs for storage in automotive are somewhat relaxed, compared to datacenters, automotive has a need for “unconventional” storage connectivity like many sensors to few CPUs to single SSD. And, unlike datacenters, automotive comes with strong constraints for size, weight and power, and real-time guaranties. Time-Sensitive Networking (TSN) is one of the best positioned options for in-vehicle networking. In combination with reliable transports such as TCP/IP this enables deterministic networking for distributed systems. MLE presents the needs of modern automotive networking and storage architectures, and approaches for converging (real-time) Ethernet and PCIe as a common fabric for reliable and cost-efficient implementations.

US Patent 11,356,388 for Real-Time Multi-Protocol Heterogeneous Packet-Based Transport

Details: Created: 07 June 2022

Missing Link Electronics has been awarded US Patent 11,356,388 on Real-Time Multi-Protocol Heterogeneous Packet-Based Transport which covers real-time and time-synchronization aspects when tunneling packets such as PCI Express (PCIe) Transaction-Layer Packets (TLP) over reliable TCP/IP over 1/10/25/50/100G Ethernet. This extends the range of PCIe and enables building distributed systems based on PCIe, or other packed-based protocols.

Network Element Virtualization Whitepaper

Details: Created: 25 April 2022

SmartNICs Make Better Networks! At SmartNICsSummit 2022, held April 26-28 in the Doubletree Hotel in San Jose, CA, Algoblu and MLE will present solutions for NEV and the use case of low-latency application. For more details, please read the joint whitepaper "Network Element Virtualization". With a foreword by Awanish Verma, Principal Architect and Director in the newly formed Data Center and Communications Group (DCCG) at AMD, Algoblu, a NaaS provider, and Missing Link Electronics, a premier partner in Xilinx Alliance ecosystem, will show how they use FPGA technology to implement Network Element Virtualization (NEV) to accelerate SD-WAN adoption.

MLE Presents at FPGA Conference Europe 2022

Details: Created: 11 April 2022

At FPGA Conference Europe 2022, MLE will present "A 10 Gigabit Ethernet TCP/IP Stack Implementation on Microsemi PolarFire for High-Speed Camera Image Transport" and will give details on FPGA-based TCP/UDP/IP Full Acceleration for camera based system. FPGA Conference Europe 2022 is organized by fellow Xilinx Alliance member PLC2 and will take place July 5-7, 2022 at the NH München Ost Conference Center.

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