FPGA Modules with Pre-validated FPGA IP

MLE’s partner, Trenz Electronic, offers FPGA Starterkits, FPGA modules (System-on-Modules), Carrier Boards and Chip-Down Turnkey Solutions.

FPGA Starter Kits

FPGA Starterkits get you faster and closer towards your FPGA target hardware. Trenz Electronic has been designing Starterkits for engineering purposes: Components have been carefully selected for availability, cost / performance and manufacturability (not just for marketing reasons). And, more important, Trenz Electronic Starterkits have a clear path towards product ramp-up, either via a risk-optimized, customized baseboard with a SoM, or via a cost-optimized so-called chipdown implementation.

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FPGA Modules (System-on-Modules)

FPGA Modules, (System-on-Modules, SoM) are Components Off-the-Shelf (COTS) which significantly de-risk your system design because many tedious and risky engineering steps have been taken care of already: Clock, power, reset, configuration, high-speed memory interfaces, etc have been implemented in a reliable and fully tested module. You can pick from large variety of SoMs with different device families, device temperatures and device speed-grades. This is combined with a very competitive pricing because you benefit from volume-based step-pricing even if you need very few units.

Trenz TE0820 MPSoC FPGA Module with AMD Zynq™ UltraScale+™ — Trenz TE0820 MPSoC-Module mit AMD Zynq™ UltraScale+™

Trenz TE0712 FPGA Module with AMD Artix™ 7 — Trenz TE0712 FPGA-Module mit AMD Artix™ 7

Trenz TE0720 SoC FPGA Module with AMD Zynq™ 7000 — Trenz TE0720 SoC-Module with AMD Zynq™ 7000

Trenz TE0813 MPSoC FPGA Module with AMD Zynq™ UltraScale+™ — Trenz TE0813 MPSoC-Module mit AMD Zynq™ UltraScale+™

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Carrier Board Design for FPGA Modules

Obviously, MLE and Trenz can help you with the design and manufacturing of your custom carrier board. Please contact us to discuss technical and commercial details. Until your custom carrier board arrives we suggest you can start development by using one of our ready-to-run carrier boards:

TEF1002 Carrier board for Trenz FPGA modules — TEF1002 Carrier board for Trenz modules

Carrierboard for a TE0728 Automotive Zynq-7020 FPGA Module — Carrierboard for a TE0728 Automotive Zynq-7020 SoC Module

UltraITX+ Baseboard for Trenz TE080X UltraSOM+ FPGA Modules — UltraITX+ Baseboard for Trenz TE080X UltraSOM+

UltraITX+ Baseboard for Trenz TE081X UltraSOM+ FPGA Modules — UltraITX+ Baseboard for Trenz TE081X UltraSOM+

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Chip-Down Turnkey Solutions

Depending on your SWAP-C (Size, Weight and Power and Cost-Down) requirements, your FPGA target hardware can be implemented via a so-called “Chip-Down” Turnkey solution. For a low NRE fee we “stretch” the PCB of the SoM to make additional space for extra components and connectors. Hence, the SoM becomes your FPGA single-board computer. This optimizes the Bill-of-Materials as it removes unwanted components including the headers between the former SoM and the former carrier board.

Integrated Solutions for Success

Success Story

4k Video Processing in FPGA with HDMI 2.0

Support a semi-custom / chip-down PCB design based on FPGA Modules (System-on-Module) from Trenz Electronic GmbH with HMDI Input and Output, hardware bring-up and testing, integrate and test HDMI 1.4/2.0 Rx and Tx subsystem (Xilinx PG236 v3.1 and PG235 v3.1) for 4k video processing, integrate Xilinx PetaLinux-based processing system for management and control.