Visit MLE at Embedded World 2025!
The Embedded World 2025 Exhibition and Conference will take place from March 11-13 in Nuremberg, Germany.
This year, partner Trenz Electronic and MLE will present many new FPGA System-on-Modules, FPGA development kits, and Multi-Gigabit Network Virtualization Solutions in form of Auto/TSN and Robo/TSN.
Auto/TSN
Auto/TSN enables Software-Defined Vehicles (SDV) and zonal architectures by virtualizing industry-standard automotive such as CAN, LIN, or CSI-2 for transport over in-vehicle network “backbones”.
Robo/TSN
Robo/TSN virtualizes IT for OT fieldbuses such as ProfiNET and EtherCAT to connect the factory cloud to the factory floor.
All are complemented by the flexible MLE Rapid Prototyping Systems that cater to software engineers and system architects for flexible, fast and efficient architecture exploration and for delivering working Proof-of-Concept solutions.
MLE Rapid Prototyping System
Feature and Benefits
- Based on open standards and open-source software
- Support for multiple, different sensor inputs
- Backbone connectivity up to 100 Gbps
- Open-source real-time operating systems
- Multi-core ARM processing system
- Flexible, adaptable FPGA design for implementing data acquisition and data preprocessing (DADP)
- Supports Secure OTA via ARM OP-TEE Trusted Execution Environment (optional)
The Rapid Prototyping System for SDV and automotive zonal architectures is available at Trenz Electronic.
Trade Show Information
Date: March 11-13, 2025
Location: Nuremberg Convention Center, Nuremberg, Germany
Booth: Hall 5 #5-140
Visit us at booth #5-140 and talk with our FPGA experts to learn about how to accelerate your industrial network connectivity with a “shift-left approach”!
MLE Partners at Embedded World 2025
