Trenz FPGA Boards

December 1, 2023

MLE’s partner, Trenz Electronic, offers FPGA Starterkits, FPGA modules (System-on-Modules), Carrier Boards and Chip-Down Turnkey Solutions.

FPGA Starter Kits

FPGA Starterkits get you faster and closer towards your FPGA target hardware. Trenz Electronic has been designing Starterkits for engineering purposes: Components have been carefully selected for availability, cost / performance and manufacturability (not just for marketing reasons). And, more important, Trenz Electronic Starterkits have a clear path towards product ramp-up, either via a risk-optimized, customized baseboard with a SoM, or via a cost-optimized so-called chipdown implementation.

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FPGA Modules (System-on-Modules)

FPGA Modules, (System-on-Modules, SoM) are Components Off-the-Shelf (COTS) which significantly de-risk your system design because many tedious and risky engineering steps have been taken care of already: Clock, power, reset, configuration, high-speed memory interfaces, etc have been implemented in a reliable and fully tested module. You can pick from large variety of SoMs with different device families, device temperatures and device speed-grades. This is combined with a very competitive pricing because you benefit from volume-based step-pricing even if you need very few units.

Trenz TE0820 MPSoC FPGA Module with AMD Zynq™ UltraScale+™ — Trenz TE0820 MPSoC-Module mit AMD Zynq™ UltraScale+™

Trenz TE0712 FPGA Module with AMD Artix™ 7 — Trenz TE0712 FPGA-Module mit AMD Artix™ 7

Trenz TE0720 SoC FPGA Module with AMD Zynq™ 7000 — Trenz TE0720 SoC-Module with AMD Zynq™ 7000

Trenz TE0813 MPSoC FPGA Module with AMD Zynq™ UltraScale+™ — Trenz TE0813 MPSoC-Module mit AMD Zynq™ UltraScale+™

More FPGA System-on-Modules

Carrier Board Design for FPGA Modules

Obviously, MLE and Trenz can help you with the design and manufacturing of your custom carrier board. Please contact us to discuss technical and commercial details. Until your custom carrier board arrives we suggest you can start development by using one of our ready-to-run carrier boards:

TEF1002 Carrier board for Trenz FPGA modules — TEF1002 Carrier board for Trenz modules

Carrierboard for a TE0728 Automotive Zynq-7020 FPGA Module — Carrierboard for a TE0728 Automotive Zynq-7020 SoC Module

UltraITX+ Baseboard for Trenz TE080X UltraSOM+ FPGA Modules — UltraITX+ Baseboard for Trenz TE080X UltraSOM+

UltraITX+ Baseboard for Trenz TE081X UltraSOM+ FPGA Modules — UltraITX+ Baseboard for Trenz TE081X UltraSOM+

More FPGA Carrier Boards

Chip-Down Turnkey Solutions

Depending on your SWAP-C (Size, Weight and Power and Cost-Down) requirements, your FPGA target hardware can be implemented via a so-called “Chip-Down” Turnkey solution. For a low NRE fee we “stretch” the PCB of the SoM to make additional space for extra components and connectors. Hence, the SoM becomes your FPGA single-board computer. This optimizes the Bill-of-Materials as it removes unwanted components including the headers between the former SoM and the former carrier board.

Integrated Solutions for Success

Success Story

4k Video Processing in FPGA with HDMI 2.0

Support a semi-custom / chip-down PCB design based on FPGA Modules (System-on-Module) from Trenz Electronic GmbH with HMDI Input and Output, hardware bring-up and testing, integrate and test HDMI 1.4/2.0 Rx and Tx subsystem (Xilinx PG236 v3.1 and PG235 v3.1) for 4k video processing, integrate Xilinx PetaLinux-based processing system for management and control.

Application Note

Shift-Left Your FPGA Design Projects

FPGA Full System Stacks comprising off-the-shelf FPGA Modules (System-on-Modules, SoM) plus pre-validated FPGA IP Cores and subsystems can greatly accelerate the time-to-market of your FPGA design project.

News

MLE Joins the Standardization Group for Embedded Technologies (SGeT) for Harmonized FPGA Module Standard Development

Sep 5, 2024

Shift-Left Your FPGA Design Project with FPGA Full System Stacks from Trenz Electronic and MLE

Mar 7, 2024

MLE and Trenz Verify the AMD/Xilinx Versal™ AI Edge Device and Accelerate Networking and Storage with 10G/25G/50G/100G TCP/IP Core

Sep 20, 2023

Request for the IP-integrated FPGA modules now!

Hardware

June 6, 2023Chip-Down Turnkey, Development Kit, FPGA boards, System-on-Modules

FPGA Hardware

De-Risk System Designs With FPGA Full System Stacks

The difficulty in programming FPGAs, in particular those System-on-Chip (SoC) FPGA with embedded CPUs, has long been considered a disadvantage that prevents FPGA from becoming a general computation solution. However, integrated and pre-validated building blocks or FPGA hardware such as FPGA Modules combined with Compute, Video, Storage and Networking FPGA software subsystems significantly increase your productivity while shortening your time-to-market for new product initiatives.

MLE provides FPGA Full System Stacks integrating FPGA hardware like Starterkits, System-on-Modules (SoMs) and customized boards from Trenz Electronic. This gives you a low-risk design trajectory from a working proof-of-concept (POC) over a low to mid volume implementation with SoMs eventually into a custom board for mid to high volume cost-down. During every single phase you will receive expert FPGA support from MLE.

FPGA Hardware Solutions

FPGA System-on-Modules

From FPGA Starterkits over FPGA Boards and System-on-Modules (SoM) to off-the-shelf or customized carrier boards, the close partnership between MLE and Trenz Electronic get you faster and closer towards your FPGA target hardware.

FPGA HPC Cards

High-Performance Compute benefits from Domain Specific Architectures to accelerate applications using FPGAs to offload CPUs. Large FPGAs with many resources, wide PCIe interfaces and High-Bandwidth Memory (HBM2), and multi-hundred Gigabit network interfaces have become a must have.

partnered with

Trenz Electronic GmbH

Trenz Electronic GmbH and MLE have established close engineering collaboration and a track record of shipping integrated FPGA boards and solutions based on Trenz System-on-Modules (SoM) running MLE’s System Software Stacks with Compute, Video, Storage and/or Network Acceleration.

partnered with

Pro Design Electronic GmbH

PRO DESIGN Electronic GmbH and MLE have partnered to provide custom turnkey solutions based on MLE FPGA Full Accelerators for Networking, Storage and Video Image Processing integrated with Pro Design Accelerator Cards.

EMS & Turnkey Solutions

June 7, 2017

EMS & Turnkey Solutions

In close collaboration with our electronic engineering and manufacturing services partners MLE provides complete, integrated turnkey solutions including hardware / PCB design and manufacturing, systems / software / FPGA development and test.

Elemaster SpA

Elemaster (former CAD-UL Electronic Services GmbH) in Ulm, Germany, and MLE have a successful history of delivering FPGA-based Turnkey Systems for Automotive, Aerospace, Defense and Test & Measurement applications. Close proximity enables both teams to respond very shortly to customer’s special needs.

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