Please fill in the form below, so we can support you in your request.
Please fill in the form below, so we can support you in your request.


    ASICAMD (Xilinx)AchronixIntel (Altera)LatticeMicrochip (MicroSemi)Other

    By submitting this form you are consenting to being contacted by the MLE via email and receiving marketing information.

    X
    CONTACT MLE
    CONTACT MLE
    We are glad that you preferred to contact us. Please fill our short form and one of our friendly team members will contact you back.


      ASICAMD (Xilinx)AchronixIntel (Altera)LatticeMicrochip (MicroSemi)Other

      By submitting this form you are consenting to being contacted by the MLE via email and receiving marketing information.

      X
      CONTACT MLE

      MLE Joins German 6G Radio Initiative, Receives BMBF Funding

      Integrated Communication and Sensing (ICAS) has become a key research topic for realizing next-generation mobility solutions. For 6G Radio, ICAS enables sensor systems to cooperate and to interact via 6G Radio Sidelink.

      MLE has joined research project “6G-ICAS4Mobility” to closely collaborate with other research partners Robert BOSCH GmbH, AeroDCS GmbH, Barkhausen Institut gGmbH, CiS GmbH, Denso Automotive Deutschland GmbH, Friedrich-Alexander-University Erlangen-Nuremberg, Fraunhofer HHI, Hensoldt Sensors GmbH, IMST GmbH, Merantix Labs GmbH, NXP Semiconductors Germany GmbH, Technical University Ilmenau, Technical University Kaiserslautern and Ulm University for realizing such systems.

      “6G-ICAS4Mobility” has been funded with 14.23 Mio Euros by the German Federal Ministry of Education and Research (BMBF) .

      MLE Presents at SNIA SDC 2022

      At SNIA Storage Developers Conference (SDC) 2022, on Sept. 14, MLE and partner Fraunhofer IPMS will present “Converging PCIe and TSN Ethernet for Composable Infrastructure in High-Performance In-Vehicle Embedded Systems”: While the needs for storage in automotive are somewhat relaxed, compared to datacenters, automotive has a need for “unconventional” storage connectivity like many sensors to few CPUs to single SSD. And, unlike datacenters, automotive comes with strong constraints for size, weight and power, and real-time guaranties. Time-Sensitive Networking (TSN) is one of the best positioned options for in-vehicle networking. In combination with reliable transports such as TCP/IP this enables deterministic networking for distributed systems. MLE presents the needs of modern automotive networking and storage architectures, and approaches for converging (real-time) Ethernet and PCIe as a common fabric for reliable and cost-efficient implementations.

      US Patent 11,356,388 for Real-Time Multi-Protocol Heterogeneous Packet-Based Transport

      Missing Link Electronics has been awarded US Patent 11,356,388 on Real-Time Multi-Protocol Heterogeneous Packet-Based Transport which covers real-time and time-synchronization aspects when tunneling packets such as PCI Express (PCIe) Transaction-Layer Packets (TLP) over reliable TCP/IP over 1/10/25/50/100G Ethernet. This extends the range of PCIe and enables building distributed systems based on PCIe, or other packed-based protocols.

      Read More

      Network Element Virtualization (NEV) With FPGA

      To enable Network Element Virtualization (NEV) for telefommunications Algoblu Co. L.t.d. from Ottawa, Ontario, Canada, has worked with Missing Link Electronics (MLE) to design and test FPGA-based turnkey solutions.

      With NEV technology, carriers can virtualize the underlying network and can fine-tune the management of network resources to provide multi-tiered services with end-to-end service quality assurance. At Provider Equipment (PE) level, NEV has been implemented as an FPGA-based PCIe card to accelerate Algoblu software running on server CPUs. For the corresponding Customer Premise Equipment (CE) a turnkey solution was designed based on an off-the-shelf FPGA System-on-Module. For more information on the NEV technology, please read the Network Element Virtualization (NEV) Whitepaper here.

      Network Element Virtualization Whitepaper

      SmartNICs Make Better Networks! At SmartNICsSummit 2022, held April 26-28 in the Doubletree Hotel in San Jose, CA, Algoblu and MLE will present solutions for NEV and the use case of low-latency application. For more details, please read the joint whitepaper “Network Element Virtualization”. With a foreword by Awanish Verma, Principal Architect and Director in the newly formed Data Center and Communications Group (DCCG) at AMD, Algoblu, a NaaS provider, and Missing Link Electronics, a premier partner in Xilinx Alliance ecosystem, will show how they use FPGA technology to implement Network Element Virtualization (NEV) to accelerate SD-WAN adoption.

      MLE Presents at FPGA Conference Europe 2022

      At FPGA Conference Europe 2022, MLE will present “A 10 Gigabit Ethernet TCP/IP Stack Implementation on Microsemi PolarFire for High-Speed Camera Image Transport” and will give details on FPGA-based TCP/UDP/IP Full Acceleration for camera based system. FPGA Conference Europe 2022 is organized by fellow Xilinx Alliance member PLC2 and will take place July 5-7, 2022 at the NH München Ost Conference Center.

      MLE NPAC-40G – A Cost-Efficient PCIe SmartNIC Solution

      , , ,

      MLE has partnered with Fraunhofer HHI and Elemaster Germany to provide the industry-proven TCP/UDP/IP Network Protocol Accelerator Platform (NPAP) in form of NPAC-40G, a PCIe Network Protocol Accelerator Card. NPAC-40G implements reliable high-bandwidth low-latency TCP/UDP/IP transport plus Linux PCIe stream drivers and, optionally, can run customizable In-Network Processing using the Intel’s Stratix 10 GX 400 FPGA.